View LT8302_8975729.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

1 for more information www.linear.com/ltm8067 typical application features description 2.8v in to 40v in isolated module dc/dc converter the lt m ? 8067 is a 2kvac isolated flyback module ? (power module) dc/dc converter. included in the package are the switching controller, power switches, transformer, and all support components. operating over an input voltage range of 2.8v to 40v, the ltm8067 supports an output voltage range of 2.5v to 24v , set by a single resistor. only output and input capacitors are needed to finish the design. the ltm8067 is packaged in a thermally enhanced, com - pact ( 9mm 11.25mm 4.92mm ) overmolded ball grid array (bga) package suitable for automated assembly by standard surface mount equipment. the ltm8067 is available with snpb or rohs compliant terminal finish. l , lt, ltc, ltm, linear technology, the linear logo and module are registered trademarks of analog devices, inc. all other trademarks are the property of their respective owners. applications n 2kvac isolated module converter n ul60950 recognized file 464570 n wide input voltage range: 2.8v to 40v n up to 450ma output current (v in = 24v , v out = 5v) output adjustable from 2.5v to 24v n current mode control n user configurable undervoltage lockout n low profile (9mm 11.25mm 4.92mm) bga package n isolated igbt gate drive n industrial sensors n industrial switches n test and measurement equipment maximum output current vs v in 2kvac isolated module regulator ltm8067 8067fc 400 600 load current (ma) max load current vs v in 8067 ta01b 8.25k 2.2f 22f v in gnd v in (v) v out v outn run fb v in 2.8v to 40v v out 5v ltm8067 8067 ta01a 0 10 20 30 40 0 200
2 for more information www.linear.com/ltm8067 pin configuration absolute maximum ratings v in , run, bias ........................................................ 42v v out relative to v outn ............................................. 25v v in + v out (note 2) ................................................... 4 8v gnd to v out C isolation (note 3) ........................... 2 kvac maximum internal temperature (note 4) .............. 12 5 c peak solder reflow body temperature ................. 245 c storage temperature .............................. C 55 c to 125 c (note 1) top view h g f e d c b a 1 2 3 4 5 6 7 bank 2 v outn bank 1 v out bank 4 gnd run fb bank 5 v in bga package 38-lead (11.25mm 9mm 4.92mm) t jmax = 125c, t ja = 20.8c/w, t jcbottom = 5.1c/w, t jctop = 18.4c/w, t jb = 5.3c/w weight = 1.1g, t values determined per jedec 51-9, 51-12 order information part number pad or ball finish part marking* package type msl rating temperature range (see note 4) device code ltm8067ey#pbf sac305 (rohs) ltm8067y e1 bga 3 C40c to 125c ltm8067iy#pbf sac305 (rohs) ltm8067y e1 bga 3 C40c to 125c ltm8067iy snpb (63/37) ltm8067y e0 bga 3 C40c to 125c consult marketing for parts specified with wider operating temperature ranges. *device temperature grade is indicated by a label on the shipping container. pad or ball finish code is per ipc/jedec j-std-609. ? terminal finish part marking: www.linear.com/leadfree ? recommended lga and bga pcb assembly and manufacturing procedures: www .linear.com/umodule/pcbassembly ? lga and bga package and t ray drawings: www.linear.com/packaging http://www.linear.com/product/ltm8067#orderinfo ltm8067 8067fc
3 for more information www.linear.com/ltm8067 electrical characteristics note 1: stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. exposure to any absolute maximum rating condition for extended periods may affect device reliability and lifetime. note 2: v in + v out is defined as the sum of (v in C gnd) + (v out C v outn ). note 3: the ltm8067 isolation test voltage of either 2kvac or its equivalent of 2.83kvdc is applied for one second. note 4: the ltm8067e is guaranteed to meet performance specifications from 0c to 125c. specifications over the C40c to 125c internal temperature range are assured by design, characterization and correlation the l denotes the specifications which apply over the full internal operating temperature range, otherwise specifications are at t a = 25c, run = 2v (note 4). parameter conditions min typ max units minimum input dc voltage run = 2v l 2.8 v v out dc voltage r adj = 15.4k r adj = 8.25k r adj = 1.78k l 4.75 2.5 5 24 5.25 v v v v in quiescent current v run = 0v not switching 7 3 a ma v out line regulation 3v v in 40v, i out = 0.1a, run = 2v 1 % v out load regulation 0.05a i out 0.3a, run = 2v 1 % v out ripple (rms) i out = 0.1a, 1mhz bw 30 mv isolation voltage (note 3) 2 kv input short-circuit current v out shorted 80 ma run pin input threshold run pin falling 1.18 1.214 1.25 v run pin current v run = 1v v run = 1.3v 2.5 0.1 a a with statistical process controls. ltm8067i is guaranteed to meet specifications over the full C40c to 125c internal operating temperature range. note that the maximum internal temperature is determined by specific operating conditions in conjunction with board layout, the rated package thermal resistance and other environmental factors. t est flowcharts are posted for viewing at: www.linear .com/quality ltm8067 8067fc
4 for more information www.linear.com/ltm8067 typical performance characteristics efficiency vs load current, v out = 2.5v efficiency vs load current, v out = 8v efficiency vs load current, v out = 24v efficiency vs load current, v out = 3.3v efficiency vs load current, v out = 12v input current vs load current v out = 2.5v efficiency vs load current, v out = 5v efficiency vs load current, v out = 15v input current vs load current v out = 3.3v unless otherwise noted, operating conditions are as in t able 1 (t a = 25c). ltm8067 8067fc 350 ef?ciency, v out = 12v 8067 g05 v in = 5v v in = 12v v in = 24v v in = 36v v in = 5v v in = 12v v in = 24v load current (ma) 30 0 50 100 150 200 250 55 65 75 85 40 efficiency (%) out 8067 g06 v in = 5v v in = 12v v in = 24v load current (ma) 0 25 50 50 75 100 125 55 65 75 85 efficiency (%) out 8067 g07 60 v in = 5v v in = 12v v in = 24v v in = 36v load current (ma) 0 50 100 150 200 70 250 300 350 0 25 50 75 100 input current (ma) v out = 2.5v 80 8067 g08 v in = 5v v in = 12v v in = 24v v in = 36v load current (ma) 0 100 200 300 efficiency (%) 400 0 25 50 75 100 125 input current (ma) v out = 3.3v 8067 g09 ef?ciency, v out = 2.5v 8067 g01 load current (ma) v in = 5v v in = 12v v in = 24v v in = 36v load current (ma) 0 50 100 150 200 0 250 300 350 400 40 50 60 70 80 efficiency (%) 50 out 8067 g02 v in = 5v v in = 12v v in = 24v v in = 36v load current (ma) 0 100 200 100 300 400 500 600 40 50 60 70 80 90 150 efficiency (%) out 8067 g03 v in = 5v v in = 12v v in = 24v v in = 36v load current (ma) 0 100 200 200 300 400 500 45 55 65 75 85 efficiency (%) 250 out 8067 g04 v in = 5v v in = 12v v in = 24v v in = 36v load current (ma) 0 50 100 300 150 200 250 300 45 55 65 75 85 efficiency (%)
5 for more information www.linear.com/ltm8067 typical performance characteristics input current vs load current v out = 5v input current vs load current v out = 8v input current vs load current v out = 15v maximum load current vs v out input current vs load current v out = 24v input current vs v in , v out shorted input current vs load current v out = 12v unless otherwise noted, operating conditions are as in t able 1 (t a = 25c). maximum load current vs v in maximum load current vs v in ltm8067 8067fc 0 150 200 250 input current (ma) input current vs v in , v out shorted 8067 g15 v in = 5v v in = 12v v in = 24v v out (v) 60 0 5 10 15 20 25 0 125 250 375 120 500 maximum load current (ma) maximum load current vs vout 8067 g16 2.5v out 3.3v out v in (v) 0 10 20 180 30 40 100 200 300 400 maximum load current (ma) in 8067 g17 5v out 240 8v out 12v out v in (v) 0 10 20 30 40 0 200 300 400 600 maximum load current (ma) max load current vs v in 8067 g18 input current (ma) out 8067 g10 v in = 5v load current (ma) v in = 12v v in = 24v v in = 36v load current (ma) 0 100 200 300 400 500 0 0 100 200 300 400 input current (ma) out 8067 g11 v in = 5v v in = 12v 100 v in = 24v v in = 36v v in = 5v v in = 12v v in = 24v v in = 36v load current (ma) 0 100 200 200 300 0 100 200 300 400 input current (ma) v out = 12v 8067 g12 v in = 5v 300 v in = 12v v in = 24v load current (ma) 0 100 200 300 0 100 200 400 300 400 input current (ma) v out = 15v 8067 g13 v in = 5v v in = 12v v in = 24v load current (ma) 0 500 50 100 150 0 100 200 300 400 input current (ma) out 600 8067 g14 v in (v) 0 10 20 30 40 0 50 100
6 for more information www.linear.com/ltm8067 maximum load current vs v in typical performance characteristics output noise and ripple dc2357a, 200ma load current frequency vs vout load current stock dc2357a demo board unless otherwise noted, operating conditions are as in t able 1 (t a = 25c). derating, 2.5v out derating, 3.3v out minimum load current vs v out over full output voltage range ltm8067 8067fc 10 15 20 25 minimum load current (ma) 8067 g20 0lfm airflow v in = 5v v in = 12v v in = 24v v out1 (v) v in = 36v ambient temperature ( c) 25 50 75 100 125 0 100 200 0 300 400 maximum load current (ma) out 8067 g23 0lfm airflow v in = 5v v in = 12v v in = 24v v in = 36v 6 ambient temperature ( c) 25 50 75 100 125 0 100 200 300 12 400 maximum load current (ma) derating, 3.3v out 8067 g24 data0 hp461 150mhz amplifier at 40db gain c5 = 470pf 2s/div 10mv/div 8067 g21 18 5v in 12v in 24v in load current (ma) 0 100 200 300 400 500 24 150 250 350 450 switching frequency (khz) stock dc2357a demo board 8067 g22 24v out 15v out v in (v) 0 0 10 20 30 40 0 100 200 300 maximum load current (ma) 5 max load current vs v in 8067 g19
7 for more information www.linear.com/ltm8067 typical performance characteristics unless otherwise noted, operating conditions are as in t able 1 (t a = 25c). derating, 12v out derating, 5v out derating, 15v out derating, 8v out derating, 24v out ltm8067 8067fc 75 100 125 0 150 300 450 600 maximum load current (ma) derating, 5v out 0lfm airflow 8067 g25 0lfm airflow v in = 5v v in = 12v v in = 24v v in = 36v ambient temperature ( c) 25 50 75 v in = 5v 100 125 0 150 300 450 maximum load current (ma) out 8067 g26 0lfm airflow v in = 12v v in = 5v v in = 12v v in = 24v, 36v ambient temperature ( c) 25 50 75 100 125 0 v in = 24v 75 150 225 300 maximum load current (ma) derating, 12v out 8067 g27 0lfm airflow v in = 5v v in = 12v v in = 36v v in = 24v v in = 36v ambient temperature ( c) 25 50 75 100 125 0 75 ambient temperature ( c) 150 225 300 maximum load current (ma) out 8067 g28 0lfm airflow v in = 5v v in = 12v, 24v ambient temperature ( c) 25 25 50 75 100 125 0 30 60 90 120 50 150 maximum load current (ma) out 8067 g29
8 for more information www.linear.com/ltm8067 pin functions v out (bank 1): v out and v outn comprise the isolated output of the ltm8067 flyback stage. apply an external capacitor between v out and v outn . do not allow v outn to exceed v out . v outn (bank 2): v outn is the return for v out . v out and v outn comprise the isolated output of the ltm8067 . in most applications, the bulk of the heat flow out of the ltm8067 is through the gnd and v outn pads, so the printed circuit design has a large impact on the thermal performance of the part. see the pcb layout and thermal considerations sections for more details. apply an external capacitor between v out and v outn . gnd (bank 4): this is the primary side local ground of the ltm8067 primary. in most applications, the bulk of the heat flow out of the ltm8067 is through the gnd and v outn pads, so the printed circuit design has a large impact on the thermal performance of the part. see the pcb layout and thermal considerations sections for more details. v in (bank 5): v in supplies current to the ltm8067s internal regulator and to the integrated power switch. these pins must be locally bypassed with an external, low esr capacitor. run (pin f3): a resistive divider connected to v in and this pin programs the minimum voltage at which the ltm8067 will operate. below 1.214v, the ltm8067 does not deliver power to the secondary. when run is less than 1.214v , the pin draws 2.5a, allowing for a programmable hysteresis. do not allow a negative voltage (relative to gnd) on this pin. tie this pin to v in if it is not used. fb (pins g7): apply a resistor from this pin to gnd to set the output voltage v outn relative to v outn , using the recommended value given in table 1. if table 1 does not list the desired v out value, the equation: r fb = 37.415 v out C0.955 ( ) k ? may be used to approximate the value. to the seasoned designer, this exponential equation may seem unusual. the equation is exponential due to nonlinear current sources that are used to temperature compensate the regulation. do not drive this pin with an external power source. package row and column labeling may vary among module products. review each package layout carefully. ltm8067 8067fc
9 for more information www.linear.com/ltm8067 block diagram v in run fb gnd 0.1f 1f v out current mode controller v outn 8067 bd ltm8067 8067fc
10 for more information www.linear.com/ltm8067 operation the ltm8067 is a stand-alone isolated flyback switching dc/dc power supply that can deliver up to 450ma of output current at 5v out, 24v in . this module provides a regulated output voltage programmable via one external resistor from 2.5v to 24v. the input voltage range of the ltm8067 is 2.8v to 40v. given that the ltm8067 is a fly - back converter, the output current depends upon the input and output voltages, so make sure that the input voltage is high enough to support the desired output voltage and load current. the t ypical per formance characteristics section gives several graphs of the maximum load versus v in for several output voltages. a simplified block diagram is given. the ltm8067 contains a current mode controller, power switching element, power transformer, power schottky diode and a modest amount of input and output capacitance. the ltm8067 has a galvanic primary to secondary isolation rating of 2kvac . for details please refer to the isolation, working voltage and safely compliance section. the ltm8067 is a ul 60950 recognized component. the run pin is used to turn on or off the ltm8067, dis - connecting the output and reducing the input current to 1a or less. the ltm8067 is a variable frequency device. for a given input and output voltage, the frequency decreases as the load increases. for light loads, the current through the internal transformer may be discontinuous. ltm8067 8067fc
11 for more information www.linear.com/ltm8067 applications information for most applications, the design process is straight forward, summarized as follows: 1. look at table 1 and find the row that has the desired input range and output voltage. 2. apply the recommended c in , c out and r fb . while these component combinations have been tested for proper operation, it is incumbent upon the user to verify proper operation over the intended systems line, load and environmental conditions. bear in mind that the maximum output current may be limited by junction temperature, the relationship between the input and output voltage magnitude and polarity and other factors. please refer to the graphs in the typical performance characteristics section for guidance. capacitor selection considerations the c in and c out capacitor values in table 1 are the minimum recommended values for the associated oper - ating conditions. applying capacitor values below those indicated in t able 1 is not recommended, and may result in undesirable operation. using larger values is generally acceptable, and can yield improved dynamic response, if it is necessar y. again, it is incumbent upon the user to verify proper operation over the intended systems line, load and environmental conditions. ceramic capacitors are small, robust and have very low esr. however, not all ceramic capacitors are suitable. x5r and x7r types are stable over temperature and ap - plied voltage and give dependable service. other types, including y5v and z5u have ver y large temperature and voltage coefficients of capacitance. in an application cir - cuit they may have only a small fraction of their nominal capacitance resulting in much higher output voltage ripple than expected. a final precaution regarding ceramic capacitors concerns the maximum input voltage rating of the ltm8067 . a ceramic input capacitor combined with trace or cable inductance forms a high-q (underdamped) tank circuit. if the ltm8067 circuit is plugged into a live supply, the input voltage can ring to much higher than its nominal value, possibly exceeding the devices rating. this situation is easily avoided; see the hot-plugging safely section. table 1. recommended component values for specific v out values v in v out c in c out r fb 2.8v to 40v 2.5v 2.2f, 50v, 1206 100f, 6.3v, 1210 15.4k 2.8v to 40v 3.3v 2.2f, 50v, 1206 47f, 6.3v, 1210 11.8k 2.8v to 40v 5v 2.2f, 50v, 1206 22f, 16v, 1210 8.25k 2.8v to 37v 8v 2.2f, 50v, 1206 22f, 16v, 1210 5.23k 2.8v to 33v 12v 4.7f, 50v, 1206 10f, 50v, 1210 3.48k 2.8v to 30v 15v 4.7f, 50v, 1206 4.7f, 25v, 1210 2.8k 2.8v to 27v 18v 4.7f, 50v, 1206 4.7f, 25v, 1210 2.37k 2.8v to 21v 24v 4.7f, 50v, 1206 4.7f, 25v, 1210 1.78k note: an input bulk capacitor is required. ltm8067 8067fc
12 for more information www.linear.com/ltm8067 applications information isolation, working voltage and safety compliance the ltm8067 isolation is 100% hi-pot tested by tying all of the primary pins together, all of the secondary pins together and subjecting the two resultant circuits to a high voltage differential for one second. this establishes the isolation voltage rating of the ltm8067 component. the isolation rating of the ltm8067 is not the same as the working or operational voltage that the application will experience. this is subject to the applications power source, operating conditions, the industry where the end product is used and other factors that dictate design re - quirements such as the gap between copper planes, traces and component pins on the printed cir cuit board, as well as the type of connector that may be used. t o maximize the allowable working voltage, the ltm8067 has two columns of solder balls removed to facilitate the printed circuit board design. the ball to ball pitch is 1.27mm, and the typical ball diameter is 0.75mm. accounting for the missing columns and the ball diameter, the printed circuit board may be designed for a metal-to-metal separation of up to 3.06mm. this may have to be reduced somewhat to allow for tolerances in solder mask or other printed circuit board design rules. for those situations where informa - tion about the spacing of ltm8067 internal circuitry is required, the minimum metal to metal separation of the primary and secondary is 1mm. to reiterate, the manufacturer s isolation voltage rating and the required working or operational voltage are of - ten different numbers. in the case of the ltm8067, the isolation voltage rating is established by 100% hi-pot testing. the working or operational voltage is a function of the end product and its system level specifications. the actual required operational voltage is often smaller than the manufacturers isolation rating. the ltm8067 is a ul recognized component under ul 60950, file number 464570. the ul 60950 insula - tion category of the ltm8067 transformer is functional. considering ul 60950 t able 2n and the gap distances stated above, 3.06mm external and 1mm internal, the ltm8067 may be operated with up to 250v working voltage in a pollution degree 2 environment. the actual working voltage, insulation category, pollution degree and other critical parameters for the specific end application depend upon the actual environmental, application and safety compliance requirements. it is therefore up to the user to perform a safety and compliance review to ensure that the ltm8067 is suitable for the intended application. safety rated capacitors some applications require safety rated capacitors, which are high voltage capacitors that are specifically designed and rated for ac operation and high voltage surges. these capacitors are often certified to safety standards such as ul 60950, iec 60950 and others. in the case of the ltm8067, a common application of a safety rated capacitor would be to connect it from gnd to v outn . to provide maximum flexibility, the ltm8067 does not include any components between gnd and v outn . any safety capacitors must be added externally. the specific capacitor and circuit configuration for any application depends upon the safety requirements of the system into which the ltm8067 is being designed. table 2 provides a list of possible capacitors and their manufacturers. the application of a capacitor from gnd to v outn may also reduce the high frequency output noise on the output. table 2. safety rated capacitors manufacturer part number description murata electronics ga343dr7gd472kw01l 4700pf, 250v ac,?x7r, 4.5mm 3.2mm capacitor johanson dielectrics 302r29w471kv3e-****-sc 470pf, 250v ac,?x7r, 4.5mm 2mm capacitor syfer technology 1808ja250102jctsp 100pf, 250v ac, c0g, 1808 capacitor ltm8067 8067fc
13 for more information www.linear.com/ltm8067 applications information pcb layout most of the headaches associated with pcb layout have been alleviated or even eliminated by the high level of integration of the ltm8067. the ltm8067 is neverthe - less a switching power supply, and care must be taken to minimize electrical noise to ensure proper operation. even with the high level of integration, you may fail to achieve specified operation with a haphazard or poor layout. see figure 1 for a suggested layout. ensure that the grounding and heat sinking are acceptable. a few rules to keep in mind are: 1. place the r fb resistor as close as possible to its respec - tive pin. 2. place the c in capacitor as close as possible to the v in and gnd connections of the ltm8067. 3. place the c out capacitor as close as possible to v out and v outn 4. place the c in and c out capacitors such that their ground current flow directly adjacent to or underneath the ltm8067. 5. connect all of the gnd connections to as large a copper pour or plane area as possible on the top layer. avoid breaking the ground connection between the external components and the ltm8067. 6. use vias to connect the gnd copper area to the boards internal ground planes. liberally distribute these gnd vias to provide both a good ground connection and thermal path to the internal planes of the printed cir cuit board. pay attention to the location and density of the thermal vias in figure 1. the ltm8067 can benefit from the heat sinking afforded by vias that connect to internal gnd planes at these locations, due to their proximity to internal power handling components. the optimum number of thermal vias depends upon the printed circuit board design. for example, a board might use very small via holes. it should employ more thermal vias than a board that uses larger holes. figure 1. layout showing suggested external components, planes and thermal vias 8067 f01 run fb ltm8067 c out1 v outn v in v out c in thermal/interconnect vias ltm8067 8067fc
14 for more information www.linear.com/ltm8067 applications information age at the v in pin of the ltm8067 can ring to more than twice the nominal input voltage, possibly exceeding the ltm8067s rating and damaging the part. if the input supply is poorly controlled or the user will be plugging the ltm8067 into an energized supply, the input network should be designed to prevent this overshoot. this can be accomplished by installing a small resistor in series to v in , but the most popular method of controlling input voltage overshoot is adding an electrolytic bulk capacitor to the v in net. this capacitors relatively high equivalent series resistance damps the circuit and eliminates the voltage overshoot. the extra capacitor improves low frequency ripple filtering and can slightly improve the efficiency of the circuit, though it can be a large component in the circuit. thermal considerations the ltm8067 output current may need to be derated if it is required to operate in a high ambient temperature. the amount of current derating is dependent upon the input voltage, output power and ambient temperature. the temperature rise curves given in the typical performance characteristics section can be used as a guide. these curves were generated by the ltm8067 mounted to a 58cm 2 4-layer fr4 printed circuit board. boards of other sizes and layer count can exhibit different thermal behavior, so it is incumbent upon the user to verify proper operation over the intended systems line, load and environmental operating conditions. for increased accuracy and fidelity to the actual application, many designers use fea to predict thermal performance. to that end, the pin configuration section of the data sheet typically gives four thermal coefficients: ja : thermal resistance from junction to ambient jcbottom : thermal resistance from junction to the bot- tom of the product case jctop : thermal resistance from junction to top of the product case jcboard : thermal resistance from junction to the printed circuit board. while the meaning of each of these coefficients may seem? to be intuitive, jedec has defined each to avoid minimum load due to the nature of the flyback regulator in general, and the ltm8067 control scheme specifically, the ltm8067 requires a minimum load for proper operation. other - wise, the output may go out of regulation if the load is too light. the most common way to address this is to place a resistor across the output. the minimum load current vs v out over full output voltage range graph in the typical performance characteristics section may be used as a guide in selecting the resistor. note that this graph describes room temperature operation. if the end application operates at a colder temperature, the minimum load requirement may be higher and the minimum load condition must be characterized for the lowest operating temperature. if it is impractical to place a resistive load permanently across the output, a resistor and zener diode may be used instead, as shown in figure 2. while the minimum load resistor mentioned in the prior paragraph will always draw current while the ltm8067 output is powered, the series resistor-zener diode combination will only draw current if the output is too high. when using this circuit, take care to ensure that the characteristics of the zener diode are ap - propriate for the intended application s temperature range. figure 2: use a resistor and zener diode to meet the minimum load requirement hot-plugging safely the small size, robustness and low impedance of ceramic capacitors make them an attractive option for the input bypass capacitor of the ltm8067 . however, these capaci - tors can cause problems if the ltm8067 is plugged into a live supply (see linear technology application note 88 for a complete discussion). the low loss ceramic capacitor combined with stray inductance in series with the power source forms an underdamped tank circuit, and the volt - ltm8067 8067fc ltm8067 v outp v outn 8067 f02
15 for more information www.linear.com/ltm8067 applications information confusion?and inconsistency. these definitions are given in jesd 51-12, and are quoted or paraphrased as follows: ja is the natural convection junction-to-ambient air thermal resistance measured in a one cubic foot sealed enclosure. this environment is sometimes referred to as still air although natural convection causes the air to move. this value is determined with the part mounted to a jesd 51- 9 defined test board, which does not reflect an actual application or viable operating condition. jcbottom is the junction-to-board thermal resistance with all of the component power dissipation flowing through the bottom of the package. in the typical module converter, the bulk of the heat flows out the bottom of the package, but there is always heat flow out into the ambient envi - ronment. as a result, this thermal resistance value may be useful for comparing packages but the test conditions dont generally match the users application. jctop is determined with nearly all of the component power dissipation flowing through the top of the package. as the electrical connections of the typical module converter are on the bottom of the package, it is rare for an application to operate such that most of the heat flows from the junc - tion to the top of the part. as in the case of jcbottom , this value may be useful for comparing packages but the test conditions dont generally match the users application. jcboard is the junction-to-board thermal resistance where almost all of the heat flows through the bottom of the module converter and into the board, and is really the sum of the jcbottom and the thermal resistance of the bottom of the part through the solder joints and through a portion of the board. the board temperature is measured a specified distance from the package, using a two-sided, two-layer board. this board is described in jesd 51-9. given these definitions, it should now be apparent that none of these thermal coefficients reflects an actual physical operating condition of a module converter. thus, none of them can be individually used to accurately predict the thermal performance of the product. likewise, it would be inappropriate to attempt to use any one coefficient to correlate to the junction temperature vs load graphs given in the products data sheet. the only appropriate way to use the coefficients is when running a detailed thermal analysis, such as fea, which considers all of the thermal resistances simultaneously. a graphical representation of these thermal resistances is given in figure 3. the blue resistances are contained within the module converter, and the green are outside. the die temperature of the ltm8067 must be lower than the maximum rating of 125c, so care should be taken in the layout of the circuit to ensure good heat sinking of the ltm8067. the bulk of the heat flow out of the ltm8067 is through the bottom of the module and the bga pads into the printed circuit board. consequently a poor printed circuit board design can cause excessive heating, result - ing in impaired performance or reliability. please refer to the pcb layout section for printed cir cuit board design suggestions. figure 3. approximate thermal model of ltm8067 8067 f03 module device junction-to-case (top) resistance junction-to-board resistance junction-to-ambient resistance (jesd 51-9 defined board) case (top)-to-ambient resistance board-to-ambient resistance junction-to-case (bottom) resistance junction ambient case (bottom)-to-board resistance ltm8067 8067fc
16 for more information www.linear.com/ltm8067 applications information C15v inverting regulator 12v flyback converter maximum load current vs v in maximum load current vs v in ltm8067 8067fc fb v in 12v v out 12v ltm8067 8067 ta03a v in (v) 0 10 3.48k 20 30 40 0 100 200 300 maximum load current (ma) out 8067 ta03b 4.7f 2.8k 4.7f 4.7f v in gnd v out v outn run fb v in 10f 5v to 31v v out ?15v ltm8067 8067 ta04a v in (v) 0 10 20 30 v in 40 0 100 200 300 maximum load current (ma) out 8067 ta04b gnd v out v outn run
17 for more information www.linear.com/ltm8067 pin function pin function pin function pin function pin function pin function pin function pin function a1 v outn b1 v outn c1 - d1 - e1 gnd f1 - g1 v in h1 v in a2 v outn b2 v outn c2 - d2 - e2 gnd f2 - g2 v in h2 v in a3 v outn b3 v outn c3 - d3 - e3 gnd f3 run g3 - h3 - a4 v outn b4 v outn c4 - d4 - e4 gnd f4 gnd g4 gnd h4 gnd a5 v outn b5 v outn c5 - d5 - e5 gnd f5 gnd g5 gnd h5 gnd a6 v out b6 v out c6 - d6 - e6 gnd f6 gnd g6 gnd h6 gnd a7 v out b7 v out c7 - d7 - e7 gnd f7 gnd g7 fb h7 gnd pin assignment table (arranged by pin number) package description package photo ltm8067 8067fc
18 for more information www.linear.com/ltm8067 package description please refer to http://www.linear.com/product/ltm8067#packaging for the most recent package drawings. 5. primary datum -z- is seating plane 6. solder ball composition is 96.5% sn/3.0% ag/0.5% cu 7 package row and column labeling may vary among module products. review each package layout carefully ! package top view 4 pin ?a1? corner y x aaa z aaa z detail a package bottom view 3 see notes h g f e d c b a 1234567 pin 1 bga 38 1212 rev a tray pin 1 bevel package in tray loading orientation component pin ?a1? notes: 1. dimensioning and tolerancing per asme y14.5m-1994 2. all dimensions are in millimeters ball designation per jesd ms-028 and jep95 4 3 details of pin #1 identifier are optional, but must be located within the zone indicated. the pin #1 identifier may be either a mold or marked feature detail a ?b (38 places) detail b substrate 0.27 ? 0.37 3.95 ? 4.05 // bbb z a a1 b1 ccc z detail b package side view mold cap z m x yzddd m zeee symbol a a1 a2 b b1 d e e f g aaa bbb ccc ddd eee min 4.72 0.50 4.22 0.60 0.60 nom 4.92 0.60 4.32 0.75 0.63 11.25 9.0 1.27 8.89 7.62 max 5.12 0.70 4.42 0.90 0.66 0.15 0.10 0.20 0.30 0.15 notes dimensions total number of balls: 38 a2 d e e b f g suggested pcb layout top view 0.000 0.635 1.905 0.635 3.175 1.905 4.445 3.175 4.445 3.810 2.540 1.270 3.810 2.540 1.270 0.3175 0.3175 0.000 4.1275 4.7625 ltmxxxxxx module bga package 38-lead (11.25mm 9.00mm 4.92mm) (reference ltc dwg # 05-08-1925 rev a) 7 see notes ltm8067 8067fc
19 for more information www.linear.com/ltm8067 information furnished by linear technology corporation is believed to be accurate and reliable. however, no responsibility is assumed for its use. linear technology corporation makes no representa - tion that the interconnection of its circuits as described herein will not infringe on existing patent rights. revision history rev date description page number a 05/16 corrected symbol of internal switch in block diagram from npn transistor to n-channel mosfet 9 b 11/16 corrected v out on maximum load current vs v in from 12v out to 24v out and from 15v out to 12v out corrected minimum metal to metal space from 0.75mm to 1mm updated the related parts table 6 12 20 c 07/17 added minimum load section 14 ltm8067 8067fc
20 for more information www.linear.com/ltm8067 ? linear technology corporation 2016 lt 0717 rev c ? printed in usa www.linear.com/ltm8067 related parts typical application 15v floating 1gbt gate drive design resources subject description module design and manufacturing resources design: ? selector guides ? demo boards and gerber files ? free simulation tools manufacturing: ? quick start guide ? pcb design, assembly and manufacturing guidelines ? package and board level reliability module regulator products search 1. sort table of products by parameters and download the result as a spread sheet. 2. search using the quick power sear ch parametric table. techclip videos quick videos detailing how to bench test electrical and thermal performance of module products. digital power system management linear technologys family of digital power supply management ics are highly integrated solutions that offer essential functions, including power supply monitoring, supervision, margining and sequencing, and feature eeprom for storing user configurations and fault logging. part number description comments ltm8068 2kvac isolated module converter with ldo post regulator 2.8v v in 40v, 1.2v v out 18v; 20v rms output ripple. ul60950 recognized. ltm8047 725vdc, 1.5w isolated module converter 3.1v v in 32v, 2.5v v out 12v ltm8048 725vdc, 1.5w isolated module converter with ldo post regulator 3.1v v in 32v, 1.2v v out 12v; 20v rms output ripple ltm8045 inverting or sepic module dc/dc convertor 2.8v v in 18v, 2.5v v out 15v or -2.5v v out C15v, up to 700ma lt ? 8300 isolated flyback convertor with 100v in , 150v/260ma power switch 6v v in 100v, no opt-isolator required lt8301 isolated flyback convertor with 65v/1.2a power switch 2.7v v in 42v, no opt-isolator required LT8302 isolated flyback convertor with 65v/3.6a power switch 2.8v v in 42v, no opt-isolator required ltm8049 dual outputs, sepic and/or inverting module regulator 2.6v v in 20v, 2.5v v out 25v, 9mm 15mm 2.42mm bga ltm8067 8067fc fb v in 12v ltm8067 15v 200ma 100vdc motor power 8067 ta02a 2.8k 4.7f 4.7f v in gnd v out v outn run

▲Up To Search▲

Price & Availability of LT8302

	To Download LT8302 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .